Semiconductor Supply Chain Bottleneck Map

Demo Preparation Report — 2026-03-09 | Data from intel/companies/data/companies.db

1. Data Inventory

13,732Companies

41,031Relationships

6,596Company Roles

2,556Revenue Segments

16Role Categories

2Discovery Waves

Relationship Types

Type	Count
Supplier	20,870
Competitor	13,650
Customer	6,411
Investor	100

Role Distribution (top 10)

Role	Count
Materials	2,282
Equipment	1,242
Services	783
Packaging	454
IP	401
Chemicals	334
Test	267
Substrate	260
Fabless	185
EDA	132

Discovery Waves

Wave	Companies	Description
0	5,304	Seed companies from industry databases, reports, Finnhub
1	8,396	Discovered through relationship expansion from Wave 0
-1	3	Manual/test entries
99	29	Special/unclassified

2. TSMC Relationship Graph

D2 diagram: present/demos/tsmc-supply-chain.d2 → present/demos/tsmc-supply-chain.svg

TSMC's Key Suppliers (from DB)

Supplier	Role	Mkt Cap
ASML	EUV lithography	$380B
Applied Materials	Deposition, etch	$200B
Lam Research	Etch, deposition	$90B
Tokyo Electron	Coater/developer	$70B
KLA Corp	Inspection	$110B
Linde	Industrial gases	$220B
Air Liquide	Specialty gases	$100B
Corning	Substrates, optics	$97B
SUMCO	Silicon wafers	—
GlobalWafers	Silicon wafers	—
Synopsys	EDA tools	$90B
Cadence	EDA tools	$80B
Advantest	Test equipment	$30B
Teradyne	Test equipment	$25B
Lasertec	Mask inspection	—

TSMC's Top Customers (from DB)

Customer	TSMC Product	Mkt Cap
NVIDIA	AI/GPU accelerators	$4.6T
Apple	A/M-series SoCs	$4.0T
Alphabet	TPU AI chips	$3.9T
Microsoft	Maia AI accelerators	$3.5T
Amazon	Graviton/Inferentia	$2.0T
Meta	MTIA custom silicon	$1.4T
Broadcom	Networking ASICs	$800B
OpenAI	AI inference chips	$500B
ByteDance	Custom AI silicon	$480B
AMD	CPUs, GPUs	$348B
Qualcomm	Snapdragon mobile	$200B
MediaTek	Mobile SoCs	—

Combined top-10 customer market cap: >$20 trillion

TSMC's Competitors (from DB)

Competitor	Ticker	Mkt Cap
Intel Foundry Services	INTC	$95B
GlobalFoundries	GFS	$25B
Samsung Foundry	005930	$259B (parent)
SMIC	0981	$10B
UMC	UMC	$20B
Tower Semiconductor	TSEM	$5B

3. Bottleneck Findings

Critical: ASML EUV Lithography Monopoly

ASML is the only company in the world that manufactures Extreme Ultraviolet (EUV) lithography machines, required for semiconductor nodes below 7nm. Each machine costs ~$380M, weighs 180 tons, ships in 40+ containers, and requires 18 months to build.

No competitor has successfully produced EUV at production scale
Our 13,732-company database confirms: zero alternative EUV lithography suppliers
Single facility risk: primary manufacturing in Veldhoven, Netherlands
Every advanced chip from TSMC, Samsung, and Intel depends on ASML machines

High: EDA Tools Duopoly

Synopsys (968 connections) and Cadence (902 connections) are the two most-connected companies in our entire database. Together they hold ~75% of the EDA market. No advanced chip can be designed without their tools.

High: TSMC Foundry Concentration

TSMC fabricates ~60% of all semiconductors and >90% of the most advanced nodes (3nm, 5nm). 559 relationships in our DB. Geographic concentration in Taiwan — a geopolitical flashpoint — amplifies risk.

Bottleneck Summary

Bottleneck	Key Players	Risk	Alternatives
EUV lithography	ASML (monopoly)	Critical	None at production scale
EDA design tools	Synopsys + Cadence	High	Open-source emerging (OpenROAD)
Advanced foundry	TSMC (~60%)	High	Samsung, Intel ramping slowly
Silicon wafers (300mm)	SUMCO, Shin-Etsu, GlobalWafers, Siltronic	Medium	4 players (oligopoly)
Photoresists (EUV)	JSR, TOK, Shin-Etsu, Fujifilm	Medium	Japanese near-monopoly
Industrial gases	Linde + Air Liquide	Medium	Duopoly, multiple plants

4. Geographic Concentration

Country	Cos	Concentration Risk
United States	5,728	Fabless design dominance; limited manufacturing reshoring
China	3,851	Aggressive self-sufficiency push; export control target
Japan	637	Materials monopolies (photoresists, chemicals); earthquake zone
India	512	Growing services/design; limited manufacturing
Taiwan	505	TSMC, MediaTek, ASE, GlobalWafers — geopolitical flashpoint
Germany	345	Infineon, materials/chemicals; ASML optics supplier (ZEISS)
South Korea	279	Samsung, SK Hynix; North Korea proximity
United Kingdom	168	ARM Holdings (chip IP)
Canada	148	Mining/materials supply
France	112	Air Liquide, STMicroelectronics

The semiconductor supply chain's three critical geographic chokepoints: Taiwan (fabrication), Netherlands (ASML lithography), and Japan (materials & chemicals). No reshoring plan can replicate this triangle quickly.

5. Network Hubs (Most Connected Companies)

#	Company	Ticker	Conns	Role
1	Synopsys	SNPS	968	EDA tools
2	Applied Materials	AMAT	968	Equipment
3	Cadence	CDNS	902	EDA tools
4	Tokyo Electron	8035	838	Equipment
5	ASML	ASML	813	Lithography
6	Shin-Etsu Chemical	4063	808	Materials
7	Samsung Electronics	005930	611	IDM / Foundry
8	Infineon	IFX	582	IDM
9	KLA Corporation	KLAC	546	Inspection
10	Intel Foundry	INTC	541	Foundry
11	TSMC	TSM	511	Foundry
12	JSR Corporation	4185	499	Photoresists
13	STMicroelectronics	STM	490	IDM
14	NXP Semiconductors	NXPI	473	IDM
15	ARM Holdings	ARM	394	IP

The most-connected companies are the supply chain's infrastructure layer — equipment makers and EDA tools that every chip company depends on. Their position in the graph is more telling than their market cap.

6. Demo Script

Full demo script at: present/demos/supplychain-bottleneck-demo.md

Duration: 5–7 minutes | Format: Narrated walkthrough with data tables and diagram

Key message: "One person + AI mapped the world's most critical supply chain and can show you where it breaks."

Flow

Opening (30s): Scale numbers — 13,700 companies, 41,000 relationships
TSMC deep-dive (2 min): Suppliers → Customers → $20T blast radius
Bottleneck analysis (2 min): ASML monopoly → EDA duopoly → geographic risk
Scale & method (1 min): Discovery waves, autonomous agents, most-connected hubs
So what (1 min): Enterprise, investor, government use cases

7. Known Issues & Data Gaps

Fixed This Session

Merged 3 TSMC entries (TSM, 2330.TW, variant) into one canonical record — 511 → 559 relationships
Added equipment sub-roles: lithography, etch, deposition, inspection, CMP — assigned to ASML, Lam, AMAT, TEL, KLA, Lasertec, Onto, Ebara
ASML now tagged as "lithography" role (not just generic "equipment")
Key suppliers (ASML, Lam, AMAT, TEL) now linked to canonical TSMC entry

Remaining Issues

Some role assignments are noisy (e.g., companies tagged "equipment" that are actually customers)
Single-source bottleneck query has false positives (e.g., Groq as "sole equipment supplier" for OpenAI)
"US" and "United States" appear as separate countries (5,728 + 101)

Coverage Gaps

Sources table is empty (0 rows) — provenance tracking not yet populated
Revenue segment data (2,556 rows) not yet cross-referenced with supply chain dependencies
No temporal data — can't show how relationships change over time

Recommended Next Steps

Deduplicate "US"/"United States" country values
Populate sources table with at least Finnhub and report origins
Extend sub-role assignments beyond the top equipment companies

Generated 2026-03-09 | Rivus Supply Chain Intelligence | Data: intel/companies/data/companies.db | Diagram: present/demos/tsmc-supply-chain.d2